PCB, BGA Assembly And Rework

Our capabilities for PCB & BGA Rework:

• BGA Component RebellingIncorporating BGA component reballing service, which involves substituting lead-free solder balls with lead solder balls, specifically for high-reliability applications.
• BGA Component ReworkIncluding BGA rework, BGA component x-ray services, repair of damaged BGA pads, and solder mask damage.
• BGA Component Site ModificationThis unique procedure uses a copper ribbon that fits under the BGA component to provide an electrical path for modification.
• Base Board Repair and ReworkIncluding repair of damaged circuit baseboard laminate, delamination, warp, hole damage, burns, and solder mask damage.
• Circuitry and Plated Hole RepairIncluding repair of damage to circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.
• Coating and Marking ReworkIncluding rework of conformal coatings and solder mask, and repair of circuit board legend and markings.
• Component ReworkIncluding removal or replacement of surface mount and through-hole components, connectors, and more.
• Component Salvage and HarvestIncludes removal and salvage of BGA and surface mount components, connectors and many other component types.
• Engineering Change ServicesIncluding engineering changes, upgrades, modifications, jumper wires, circuit cuts, and many other procedures.
• Inspection ServicesIncluding BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.
• SMT/BGA Pad RepairIncluding repair of damaged or missing surface mount pads, BGA pads, and BGA pads with integral via.

COMPONENTS SOURCING & SUPPLY CHAIN

While Wah Industry provides worldwide options for sourcing components to meet customer needs and quantities, our regional flexibility is reinforced by partnerships with multiple authorized distributors.